The primary function of this position will be mechanical characterization engineering including sample preparation, test data collection, maintaining and modifying equipment, and developing and documenting new test methods. This position is also responsible for basic project management planning and tracking required for on-time delivery of the aforementioned activities.
Major responsibilities of this position include:
- Mechanical testing including sample preparation
- Development of new test methods and equipment
- General laboratory project tracking and support activities (i.e. materials and parts selection & equipment engineering)
This position requires a BS in Material Science or related field. A MS degree in scientific or engineering discipline is preferred. Additionally, 1 to 5 years of advanced packaging related project work. Direct hands-on experience with mechanical test sample preparation and PBGA assembly techniques such as solder ball attach and familiarity with laminate substrate design and construction is desired. Engineering data analysis skills and design of experiments, knowledge of solder property testing and failure analysis techniques are required. Must possess the ability to manage laboratory programs according to schedule, and communicate status and results effectively. Candidates must have a fundamental understanding of solder based interconnection processes and technology. Knowledge of packaging materials in general and reliability testing techniques such as thermal cycling, bend, and drop testing is also required.
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